wuxi lead intelligent equipment co., ltd.-凯发在线

wafer laser grooving machine
description:
wafer laser grooving machine adopts customized wafer dicing-specific laser(ns&ps options), 2-dimensional platform for linear motor, closed-loop cnc system and high-resolution ccd positioning technology to perform poly beam trimming and processing. the unique optical system thus designed ensures high-quality nondestructive cutting. the product has an independent intellectual property.
benefits:
1. multiple light source options, wide application and compatibility;
2. high multi-point diffraction efficiency, more efficient light path and laser control system;
3. brand new automatic handling system, without wafer falling;
4. stable laser and movement closed-loop system;
5. continuous variable light spot and cutting width;
6. automatic deviation correction of cutting path with a warning system;
7. dual barrel design of cleaning and coating, improving efficiency and effect
polybeam trimming & processing
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