wuxi lead intelligent equipment co., ltd.-凯发在线

backside wafer marking machine
description:
backside wafer marking machine, using a high-precision positioning platform and closed-loop cnc system and being equipped with high- resolution ccd positioning techniques and aoi detection, marks wafer on its backside. wafer is loaded/unloaded automatically. and the machine has an independently-owned intellectual property.
benefits:
1. vision accuracy: ±10um; platform positioning repeatibility: ±5um; whole machine accuracy: ±50um;
2. single head efficiency surpasses that of average duplex heads by even 50%,compatible with 8-/12-inch foup, cassette;
3. equipped with wafer smoothing unit for soft wafer marking, and high-precision hardware for wafer warping≤12mm;
4. laser: green laser; fan cooling; modular design
green laser
fan cooling
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